1. 华中科技大学-国伟华教授 时间：2017年6月22日上午 10:00-11:30 地点：浙江大学紫金港校区东五楼光及电磁波研究中心 212会议室 题目：新型半导体激光器的研究 简介：国伟华，中国科学院半导体研究所微电子学与固体电子学博士，华中科技大学武汉光电国家实验室教授。2003年获中国科学院院长奖学金优秀奖，2005年获中国科学院优秀博士论文，2013年入选中组部第五批“青年千人计划”。在半导体光电器件、半导体光电集成领域具有10多...
1. 华中科技大学-国伟华教授
时间：2017年6月22日上午 10:00-11:30
地点：浙江大学紫金港校区东五楼光及电磁波研究中心 212会议室
题目：新型半导体激光器的研究
简介：国伟华，中国科学院半导体研究所微电子学与固体电子学博士，华中科技大学武汉光电国家实验室教授。2003年获中国科学院院长奖学金优秀奖，2005年获中国科学院优秀博士论文，2013年入选中组部第五批“青年千人计划”。在半导体光电器件、半导体光电集成领域具有10多年的工作经验。曾经深入研究过的器件包括：微腔激光器、双光子吸收探测器、大范围调谐激光器、高速干涉型调制器、高速探测器、波导阵列光栅等等。曾经参与并起关键作用的光集成项目包括：大范围调谐激光器与高速干涉型光调制器的单片集成（爱尔兰CTVR项目）；大范围调谐激光器和光学相控阵列的单片集成（美国DARPA SWEEPER项目）。在IEEE Photonics Technology Letters、Journal of Selected Topics in Quantum Electronics、Electronics Letters、Optics Express等半导体光电领域核心期刊以及OFC、ECOC、CLEO等半导体光电领域的重要会议，发表文章100多篇，总引用1200多次（Google Scholar数据）。目前主要从事新型半导体光电器件以及大规模光子集成器件的研究，主要包括单片集成的大范围可调谐激光器、高速直调的分布反馈激光器、高速直调的微腔面发射激光器、单片集成相干光接收器、高速Mach-Zehnder调制器、大型光学相控阵光子集成芯片、基于氮化铝的无源器件等。这些器件在光通信、光学检测领域具有潜在的应用前景。
2. Dr. Di Liang from HP lab, USA.
Time: 13:00-14:30, June 22, 2017
Venue: Room 212, East building #5, Zijingang Campus, ZJU
Title: Robust multi-wavelength light sources for energy-efficient Si photonics
Abstract: Large-scale computer installations are now severely limited by network bandwidth constraints and energy costs arising from architectural designs originally based on copper interconnects. Hewlett Packard Enterprise (HPE), formerly HP, joins the global effort to develop high-quality optical interconnects with our focuses on low-cost integration platform and minimal power consumption for our datacenter and supercomputer business. As a major limiting factor in overall link power budget and cost, light source research and development remains a critical area to break through. In this talk, I will review our recent effort in developing multi-wavelength light sources in heterogeneous IIIV-on-silicon platform with novel laser structure and attractive new materials, and current effort to integrate them with CMOS drivers.
Biography:
Di Liang is currently a leading senior research scientist at Hewlett Packard Enterprise Labs to develop heterogeneous III-V-on-silicon photonics platform. His research interests include diode lasers, III-V and silicon photonics, heterogeneous material integration and nanofabrication technology. He has authored and coauthored over 140 journal and conference papers, 5 book chapters, and was granted for 10 patents (multiple regions filing) with another 45+ pending. He received his B.S. degree in Optical Engineering from the Zhejiang University, China, and Ph.D. degree in Electrical Engineering from the University of Notre Dame, USA. He is a senior member of IEEE and a member of OSA.
